3.2.1 Socket Body
3.2.1.1 Housing
The housing material will be a thermoplastic or equivalent, UL 94 V-0 flame rating,
temperature rating and design capable of maintaining structural integrity following a
temperature of 260°C for 40 seconds which is typical of a reflow/rework profile for
solder material used on the socket. The material must have a thermal coefficient of
expansion in the XY plane capable of passing reliability tests rated for an expected high
Mechanical Requirements
12 LGA 771 Socket Mechanical Design Guide
operating temperature, while mounted on an FR4-type motherboard material. The
creep properties of the material must be such that the mechanical integrity of the
socket is maintained for the use condition outlined in Section 5.
The color of the socket housing will be dark as compared to the solder balls to provide
the contrast needed for surface-mount (SMT) equipment pick and place vision systems.
Components of the socket may be different colors as long as they meet the above
requirement.
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